| 圖像 | 型號(hào) | 品牌 | 描述 | 單價(jià) | 封裝 | 系列 | PDF資料 |
|---|---|---|---|---|---|---|---|
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GN25L52-GRP6 | Semtech Corporation | IC AMP TIA 2.5GB OC-48 DIE RING | 面議 | * |  點(diǎn)擊下載 |
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GN25L52-GRP8 | Semtech Corporation | IC AMP TIA 2.5GB OC-48 DIE RING | 面議 | * | 點(diǎn)擊下載 |
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GN25L53-GRP6 | Semtech Corporation | IC AMP TIA 2.5GB OC-48 DIE RING | 面議 | * | 點(diǎn)擊下載 |
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GN25L53-GRP8 | Semtech Corporation | IC AMP TIA 2.5GB OC-48 DIE RING | 面議 | * | 點(diǎn)擊下載 |
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GN1032W-CHIP | Semtech Corporation | IC AMP TIA 2.5GBPS SONET CHIP | 面議 | - | - | 點(diǎn)擊下載 |
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GN1035CWA-CHIP | Semtech Corporation | IC AMP TIA 2.5GBPS SONET CHIP | 面議 | - | - | 點(diǎn)擊下載 |
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GN1055CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V 10/11.3GBPS | 面議 | - | - | 點(diǎn)擊下載 |
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GN1056CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V 10G LIN OC-192 | 面議 | - | - | 點(diǎn)擊下載 |
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GN1057CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V AGC 10/11.3GBPS | 面議 | - | - | 點(diǎn)擊下載 |
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GN1068-GRP6 | Semtech Corporation | IC AMP TIA LIMIT 16G FC GRIP RNG | 面議 | - | - | 點(diǎn)擊下載 |
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GN1068-CHIP | Semtech Corporation | IC AMP TIA LIMITING FOR 16G FC | 面議 | - | - | 點(diǎn)擊下載 |
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GN1083-CHIP | Semtech Corporation | IC AMP TIA LIMITING QUAD 25G | 面議 | - | - | 點(diǎn)擊下載 |
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GN7052-CHIP | Semtech Corporation | IC AMP TIA MULTI TRI-RATE DIE | 面議 | * | 點(diǎn)擊下載 |
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ADN3010-11-50A-RL7 | Analog Devices Inc. | IC AMP TRANSIMPEDANCE DIEFORM | 面議 | 模具 | - | 點(diǎn)擊下載 |
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ADN3010-11-50A-DF | Analog Devices Inc. | IC OPT RCVR 11.3GBP 6""FILM FRAME | 面議 | 模具 | - | 點(diǎn)擊下載 |
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GN1084-CHIP | Semtech Corporation | TIA - CHIP FORM | 面議 | * | 點(diǎn)擊下載 |
CopyRight ? 2019 中航微射 版權(quán)所有 備案號(hào)：粵ICP備12068708號(hào) 技術(shù)支持：亞網(wǎng)互聯(lián)
